Next-Generation Liquid Cooling for Ultra-High-Density Environments
Legrand, in partnership with Accelsius , offers two-phase liquid cooling models to the data center market, a complete cooling solution engineered for extreme-density computing in hyperscale data centers, NeoCloud facilities, and AI factories.
Using a highly efficient two-phase process with a dielectric, non-conductive refrigerant, two-phase cooling removes heat directly at the chip faster and more effectively than single-phase systems. As the refrigerant boils on contact with the chip surface, it absorbs large amounts of energy during phase change, rapidly pulling heat away from CPUs and GPUs, resulting in significantly greater thermal efficiency.
The result is more tokens per watt, lower operational costs, and superior thermal performance, with zero risk of GPU damage from conductive fluids. By removing heat at the source, two-phase direct-to-chip cooling enables higher compute densities and improved energy efficiency for demanding AI and HPC workloads.
With support for 4,500W+ per socket and rack densities up to 250kW today, with future capabilities targeting up to 2MW per rack, two-phase cooling is appropriate for ultra-high-density deployments. At these extreme thermal design power (TDP) levels, two-phase cooling is the only technology capable of managing the heat generated by the most advanced AI processors , making it a future-proof solution for next-generation data center infrastructure.
Why Legrand Two-Phase Direct-to-Chip Cooling?
Our Product Offering:
IR150/215
Reimagined for the mission-critical liquid cooling era, the I R150 integrates a two-phase CDU directly into an 800mm wide IT enclosure. The design allocates 200mm to cooling infrastructure and 600mm to 42U of server space, providing 150kW of capacity.
With built-in rack manifolds, it offers a plug-and-play solution for high-density, two-phase-enabled deployments.
Key Benefits
Pre-Integrated Solution
- Includes 150kW CDU
- 42U of available IT rack space
- Liquid and vapor manifolds
Modular & Scalable
- Single-rack failure domain
- Simplifies the deployment of two-phase enabled servers
Racks Redesigned for the Liquid Cooling Era
- Unique vertical integration of CDU enables complete separation of mechanical and IT components
- Optimized for the modern era of overhead facility water
MR250
The MR250 is a highly advanced two-phase, direct-to-chip cooling solution designed to deliver up to 250kW of liquid-cooling capacity to support large-scale deployments of high-density racks.
Connect the MR250 to one or two racks. Each MR250 includes integrated pumps, vaporators, and manifolds for a holistic liquid-cooling solution. This frees up the majority of the rack for additional servers and rack PDUs, enabling dense AI and HPC workloads.
Key Benefits
Multiple Configurations
- Supports 1 x 250kW rack or 2 x 125kW racks
- Warm Rack Expansion
Integrated Overhead Manifolds
- Reduced TCS complexity and costs
- Speeds deployment and scalability
Ease of Service
- Multiple redundancies with hot-swappable servicing (pumps, PSUs, control board)
- Estimated 85% FIR rate does not require an HVAC tech
